New Arrivals Equipments Tools BGA Stencil Amaoe Android Cpu Stencil MQ:3
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Amaoe Android Cpu Stencil MQ:3
Amaoe MQ3 BGA Reballing Stencil for SM8250 MT6885Z SM6125 SM7150 SM7250 SDM865 Qualcomm MTK CPU RAM IC Chip Tin Plant Steel Mesh
15.00 TND
In stock
In stock
- Delivery
Delivery to your specified address
7 TND
20 May - 21 May
- Local pickup
To pick up from Nanotek
Free
Moncef Bey
SKU:
193
Category: BGA Stencil
Tags: Amaoe, bga, mediatek, Reballing, Stencil, Stencil Qualcomm, ستنسل, شبلنة
Description
Amaoe MQ3 BGA Reballing Stencil for SM8250 MT6885Z SM6125 SM7150 SM7250 SDM865 Qualcomm MTK CPU RAM IC Chip Tin Plant Steel Mesh
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